1. Who is going to be affected by the new lead-free assembly requirements?
Anybody who is exporting goods into Europe, Japan and the USA, with a few exceptions (see below). However , over time, everybody will be affected by component availability as manufactures rationalise their product lines to exit leaded parts and convert to Lead Free manufacturing.
2. What parts of a PCB assembly are affected by ROHS Compliance.
Basically all components are affected, from the Bare PCB, to loaded components, to the solder used for assembly. Additionally the chemicals & materials used to manufacture these components are also affected.
3. What products have to be assembled using Lead-free processes?
In general, all products being sold to Europe, Japan and 13 states in the USA, unless you can obtain an exemption (eg; medical / military applications, & automotive industry)
4. What is Labtam doing to cater for ROHS Compliance requirements?
Significant investment has been made on new equipment some of which is now operating and the remainder is due for commissioning in September 2006 consisting of:-
• A new ERSA Hotflow 2/14 Reflow Oven
• A new ERSA Versaflow Dual Selective Soldering System
• A new Soltech Delta Wave Soldering System
• New In-Line loading conveyors
• New Lead Free Soldering Stations
We are taking this opportunity to optimise the factory layout with the installation of new equipment.
The Material Control Centre is being reorganised to cater for both lead-free and lead-based components with 2 segregated warehouses.
5. Will current lead-based components have a lead-free equivalent?
Labtam’s experience at this stage is that there will NOT be equivalents made for all components currently available in tin/lead form. Further, recent experience shows that even pin compatible replacement parts may have differences which result in errors in finished product functionality.
As a result Labtam recommends a due diligence review based on lead free component availability, especially for aging designs & those intended for export.
6. Why is it so important to separate lead-free and lead-based components?
Eliminate the risk of lead contamination in a lead free process or assembly.
Conventional tin/lead components may not be able to withstand the elevated temperatures required for a lead free process.
ALL boards being assembled in the lead-free process will be treated equally; ie ZERO contamination will be acceptable.
7. Will costs increase Lead Free assembly?
Unfortunately yes. Apart from the basic fact that lead-free solder is more expensive, the additional controls required to maintain accurate identification & segregation within the MCU from inwards goods to production. Unfortunately, there is no uniformity worldwide by suppliers in identification of lead-free components. This will be particularly the case for customer supplied kits which we now have to ensure are lead free so no other kits are cross contaminated.
8. Will Labtam substitute a few lead-based parts to complete a lead-free based assembly?
NO. Labtam will not jeopardise the lead-free process in order to complete the assembly.
If you require lead-based components to be hand soldered, Labtam will not pass the board as ROHS compliant.
9. When will Labtam pass an assembly as ROHS compliant?
Labtam will only pass an assembly as ROHS compliant when Labtam loads ALL parts and those parts have been verified as ROHS compliant.
10. Can lead-free components be used in a lead-based assembly?
Yes. Many parts being loaded today are lead free and have been for some years.
11. Will Labtam continue to provide a lead based assembly process?
Yes, Labtam will provide lead based assembly for some time to come. However in time we do expect lead free to become the standard process.
12. What is the effect on component availability?
Some parts are readily available and many are not but will be shortly. Many leaded parts are becoming harder to get as manufacturers change to unleaded parts and the supply chain tries to ensure it is not caught with them.
